品名手機主板類型八層二階（1+1+4+1+1）埋/盲孔/化金/阻抗板結(jié)構(gòu)T1.0mmFR4+RCC1/0.5/0.5/0.5/0.5/0.5/0.5/1OZ最小基板厚0.15mm阻抗L1層單線阻抗W=4mil60Ω+/-10％L3層單線阻抗W=4mil60Ω+/-10％單線阻抗W=10mil45Ω+/-10％L8層單線阻抗W=4mil60Ω+/-10％其它L1-L8層通孔最小成品8milL3-L4，L2-L7層埋孔最小成品8milL1-L2，L2-L3，L8-L7，L6-L5二階層盲孔6mil激光打孔4mil成品孔徑最小線寬/線距W=4milS=4mil外型公差+/-0.1mm