PRODUCTTYPE產(chǎn)品類型■高頻印制板（ＨＦＰＣＢ）適用微波傳輸電子產(chǎn)品HighfrequencyPCB(HFPCB)suitableforelectricproductswithmicrowavetransmission■單面印制板（SPCB）基材FR4Single-sidedPCB(SPCB)withbasematerialofFR4■雙面印制板（SPCB）基材FR4Double-sidedPCB(DPCB)withbasematerialofFR4■多層印制板(MPCB)基材FR4、PPMulti-layerPCB(MPCB)withbasematerialofFR4andPP■高密度印制板（HDIPCB）含埋/盲孔，適用BGA電子產(chǎn)品High-densityPCB(HDIPCB)includingbuilt-in/blindholes，whichissuitableforBGAelectricproducts■鋁基印制板適用大功率散熱電子產(chǎn)品AluminumbasePCBsuitableforelectricproductswithhighpowerheatdissipationCAPABILITY制作能力■產(chǎn)品類型（ProductType）單面板/雙面板/多層板3-12層（Singleside/doubleside/mutilayer3-12layers）■常用基材（BaseMaterial）高頻板材（HFBaseMaterial）FR-4、CEM-3鋁基板材（Albasicmaterial）陶瓷板材（Ceramicbasicmaterial）■板厚度（BoardThickness）內(nèi)層芯片0.15-1.50mm（Innercore）總厚度0.20-3.50mm（TotalThickness）■板厚公差（ToleranceofBoardThickness）內(nèi)層芯最大公差±0.08mm（InnerCoreThickness）總厚度公差±0.15mm（Toleranceoftotalboardthickness）■銅箔厚17-175μm（CopperFoilThickness）■最大加工面積800×500mm（Max.UnitArea）■最小產(chǎn)品面積2×10mm（Min.UnitArea）■最小孔徑0.3mm/12mil（Min.HoleSize）■最小線寬0.127mm/5mil（Min.LineWidth）■最小間距0.127mm/5mil（Min.Space）■阻焊油墨（Tamura）Dsr-2200（NANIA）LP-3G（SolderMask）■外形加工精度0.15mm（PrecisionofOutling）■表面處理（SurfaceTreatment）噴錫（SloderCoating）（Gold.NickelPlating）（ElectronessAu）沉金（Cobalt/GoldPlating，HardGold）鍍鈷/金（硬金）（OSPCoating）OSP涂膜■內(nèi)層對(duì)位公差±0.10mm（ToleranceoflnnerAqaistOuterlayer）■生產(chǎn)能力6000M2/月（month），200M2/日（day）（ProductingCapacity）■交貨周期樣品2-3天批量5-8天Thecompanyiscommittedtothesupplyofsampleswithin2-3daysandmassproductionproductswithin5-8daiys.